THz Packaging Solution for Low Cost Si-based 40 Gb/s Wireless Link System
Lacombe, E.
; Gianesello, F.
; Luxey, C.
; Durand, C.
; Titz, D.
;
Costa, J.R.
;
Fernandes, C. A.
; Del-Río, C.
; Ducournau, G.
; Gulan, H.
; Zwick, T.
THz Packaging Solution for Low Cost Si-based 40 Gb/s Wireless Link System, Proc European Conf. on Antennas & Propagation - EUCAP, London, United Kingdom, Vol. , pp. - , April, 2018.
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Abstract
This paper presents an innovative low-cost transmitter solution aimed at improving telecommunication networks capacities in order to support the massive data traffic growth. Sub-THz frequencies > 200 GHz are considered to target at least 40 Gb/s. The proposed transmitter consists of a Silicon Photonic integrated sub-THz source and an industrial antenna integrated in HDI organic packaging substrate. As these components were experimentally evaluated, a real-time error free wireless data transmission of 10 Gb/s was successfully achieved and an antenna gain of 5.5 dBi was measured in the broadside direction from 220 GHz to 240 GHz (8.7% relative bandwidth). With the addition of a low-cost dielectric lens, a gain of 17 dBi was reached.
