Creating and sharing knowledge for telecommunications

Project: PIXEurope: Advanced Photonic Integrated Circuits Pilot Line for Europe

Acronym: PIXEurope
Main Objective:
PIXEurope will create the world’s first fully integrated Open Access PIC Pilot Line, grouping Europe’s top research organisations across all areas of advanced PIC technologies. Combined, they will establish a uniquely unified and standardised PIC ecosystem, placing Europe in a global leadership position and giving Europe sovereignty and a competitive advantage in this critically important future technology. Investments in state-of-the-art equipment will establish critical European infrastructure to develop breakthrough PIC technologies. This goes beyond what is currently available at other state-of-the-art facilities globally, such as the flagship American Institute for Manufacturing (AIM) Integrated Photonics initiative in the US. PIXEurope will offer a wider range of advanced monotlithic PIC platforms (Si, SiN, SiC, InP, AlO, and Ge-Si), novel materials integration processes, advanced wafer-level packaging processes, high-throughput test and reliability analysis procedures, all available through standardised and accessible Design Kits (Figure 1). The proposed technical breakthroughs will also enable the integration of PICs with EICs to produce advanced semiconductor systems.
Region of Intervention: Europe
Reference: 101213727
Funding: CHIPS JU, ANI - Agência Nacional de Inovação, CCDR - Centro
Approval Date: 01-06-2025
Start Date: 01-06-2025
End Date: 31-05-2030
Team: Miguel Vidal Drummond, Pedro Filipe Vieira Rito, Antonio Luis Jesus Teixeira, Ricardo Jorge Figueiredo Oliveira, Cláudia Marina Mónica de Oliveira Barbosa
Groups: Optical Sensors and Integrated Photonics - Av
Partners: ICFO, TNI, TU/e, UPV, VTT, IMEC, CSIC, TNO, UTWENTE, UC3M, UGENT, UVIGO, IT, WUT, SAL, CEA-LETI
Local Coordinator: Miguel Vidal Drummond

Associated Publications