Acronym: PIXEurope |
Main Objective: PIXEurope will create the world’s first fully integrated Open Access PIC Pilot Line, grouping Europe’s top research organisations across all areas of advanced PIC technologies. Combined, they will establish a uniquely unified and standardised PIC ecosystem, placing Europe in a global leadership position and giving Europe sovereignty and a competitive advantage in this critically important future technology. Investments in state-of-the-art equipment will establish critical European infrastructure to develop breakthrough PIC technologies. This goes beyond what is currently available at other state-of-the-art facilities globally, such as the flagship American Institute for Manufacturing (AIM) Integrated Photonics initiative in the US. PIXEurope will offer a wider range of advanced monotlithic PIC platforms (Si, SiN, SiC, InP, AlO, and Ge-Si), novel materials integration processes, advanced wafer-level packaging processes, high-throughput test and reliability analysis procedures, all available through standardised and accessible Design Kits (Figure 1). The proposed technical breakthroughs will also enable the integration of PICs with EICs to produce advanced semiconductor systems. |
Region of Intervention: Europe |
Reference: 101213727 |
Funding: CHIPS JU, ANI - Agência Nacional de Inovação, CCDR - Centro |
Approval Date: 01-06-2025 |
Start Date: 01-06-2025 |
End Date: 31-05-2030 |
Team: Miguel Vidal Drummond, Pedro Filipe Vieira Rito, Antonio Luis Jesus Teixeira, Ricardo Jorge Figueiredo Oliveira, Cláudia Marina Mónica de Oliveira Barbosa |
Groups: Optical Sensors and Integrated Photonics - Av |
Partners: ICFO, TNI, TU/e, UPV, VTT, IMEC, CSIC, TNO, UTWENTE, UC3M, UGENT, UVIGO, IT, WUT, SAL, CEA-LETI |
Local Coordinator: Miguel Vidal Drummond |
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Associated Publications
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