IT researcher Mohsen Barzegar, from the Instrumentation and Measurements -Lisboa group, received the IEEE FENDT-EINTIK Best Paper Award - First Prize at the 2026 Far East Conference on Nondestructive Testing/Far East NDT New Technology Forum, held in Nanchang, China. The award was presented by the IEEE FENDT Organization Committee and recognized the paper “RPCA-Based Full Wavefield Processing for Ultrasonic Imaging of Disbonds in CFRP Adhesive Joints”, authored by Mohsen Barzegar, Muchao Zhang, Dario J. Pasadas, and Helena G. Ramos. The work proposes an ultrasonic full-wavefield signal-processing approach based on Robust Principal Component Analysis (RPCA) for imaging disbonds in CFRP adhesive joints.
The 2026 FENDT Forum was held from 22 to 25 June 2026 in Nanchang, China, and included technical sessions covering topics such as ultrasonic guided wave testing, sensors and instruments, AI-based NDT, and multi-array sensing and imaging technologies.