Creating and sharing knowledge for telecommunications

Call for Papers - 12th International Conference on Pattern Recognition Applications and Methods (ICPRAM)

on 22-02-2023

... The 12th International Conference on Pattern Recognition Applications and Methods (ICPRAM) will take place in Lisbon, Portugal, on 22-24 February 2023.

ICPRAM is a major point of contact between researchers, engineers, and practitioners in the areas of Pattern Recognition and Machine Learning, both from theoretical and application perspectives. Contributions describing applications of Pattern Recognition techniques to real-world problems, interdisciplinary research, and experimental and/or theoretical studies yielding new insights that advance Pattern Recognition methods are especially encouraged.

Papers describing original work are invited in any of the areas listed below. Accepted papers, presented at the conference by one of the authors, will be published in the proceedings of ICPRAM with an ISBN. Acceptance will be based on quality, relevance, and originality. There will be both oral and poster sessions.

Special sessions, dedicated to case-studies and commercial presentations, as well as technical tutorials, dedicated to technical/scientific topics, are also envisaged: companies interested in presenting their products/methodologies or researchers interested in presenting a demo or lecturing a tutorial are invited to contact the conference secretariat.

ICPRAM is chaired by Ana Fred, researcher at Instituto de Telecomunicações and Professor at Instituto Superior Técnico, Portugal, and co-chaired by Maria De Marsico, Sapienza Università di Roma, Italy, and Gabriella Sanniti di Baja, Italian National Research Council CNR, Italy.

Conference areas:

Advanced Learning Methods
Linear Models and Dimensionality Reduction
Machine Learning Methods
Model Representation and Selection
Shape Representation
Signal Processing
Bayesian Models and Stochastic Methods
Classification and Clustering
Deep Learning and Neural Networks
Ensemble Methods
Feature Selection and Extraction
Knowledge Acquisition and Representation

Audio and Speech Analysis
Motion Tracking and Action Recognition
Natural Language Processing
Sensors and Early Vision
Virtual Environments
Bioinformatics and Systems Biology
Data Mining and Algorithms for Big Data
Document Analysis
Image and Video Analysis and Understanding
Industry Related Applications
Information Retrieval
Medical Imaging

Regular Papers
Paper Submission: October 10, 2022
Authors Notification: December 6, 2022
Camera Ready and Registration: December 20, 2022

Position Papers
Paper Submission: November 17, 2022
Authors Notification: December 22, 2022
Camera Ready and Registration: January 9, 2023

Doctoral Consortium
Paper Submission: January 2, 2023
Authors Notification: January 13, 2023
Camera Ready and Registration: January 23, 2023

Tutorial Proposal: January 13, 2023

Demo Proposal: January 13, 2023

Panel Proposal: January 13, 2023

Abstract Submission: January 2, 2023
Authors Notification: January 13, 2023
Camera Ready and Registration: January 23, 2023

ICPRAM is sponsored by INSTICC – Institute for Systems and Technologies of Information, Control and Communication.

Further on how to submit your paper:
More Information..

Call for Papers - 27th Edition of SPI: IEEE Workshop on Signal and Power Integrity

on 07-05-2023

... Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.

In view of previous years' success, the Committees are hardworking and keen on the 27th Edition which will be held as an in-person event in Aveiro, Portugal, on 7-10 of May of 2023. The technical program will include both oral and poster sessions, and several prominent experts will give keynotes on emerging interest areas. Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest:

• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design

Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®). Authors of the best-ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology. Please visit for further information.

Students presenting a paper at the workshop may apply to the Student Awards. Please visit this next for further information:

(a) IEEE Electronics Packaging Society: Student Travel Grants
(b) IEEE SPI 2023: Best Student Paper

One of the goals for SPI 2023 is to provide an exceptional level of international exposure for Companies interested in sponsoring the event by promoting their products and services to all participants and significantly enhancing their visibility and reputation on Signal and Power Integrity expertise.

Registration for Sponsors is open! Please visit the next link for more on sponsorship conditions:

The Workshop Chairs:

Joana Catarina Mendes: Instituto de Telecomunicações, Aveiro (POR)
Stefano Grivet-Talocia: Politecnico di Torino, Torino (ITA)

• Full Paper Submission: January 31st, 2023
• Notification of Acceptance: March 15th, 2023
• Final Paper Submission: April 5th, 2023
• Early Bird Registration: April 5th, 2023
• Sponsors Registration: April 5th, 2023
• Student Awards Application: March 31st, 2023

Find more on the workshop webpage:

More Information..