Creating and sharing knowledge for telecommunications

EAI GOODTECHS 2022 - 8th EAI International Conference on Smart Objects and Technologies for Social Good

on 14-09-2022

... Technology is improving fast, providing new opportunities for the development of ICT technologies for well-being. Coupled with the growth in e-Health and m-Health novel Social Good solutions can be created that act as preventive, promoting healthy lifestyles and active coaching to avoid unhealthy habits. There are various solutions currently under development related to this field, which is highly multidisciplinary and an extensive subject to promote widespread health and well-being practices.

EAI GOODTECHS 2022 will take place in Aveiro city, Portugal, on September 14-16 2022, and will be is focused on cutting-edge experiences with the design, implementation, deployment, operation, and evaluation of smart objects and technologies for Social Good.

The conference is organized by EAI – European Alliance for Innovation, a non-profit organization, and a professional community established in cooperation with the European Commission to empower global research and innovation, and to promote cooperation between European and International ICT communities.

The general chairs of the organizing committee are Hugo Plácido da Silva, from Instituto de Telecomunicações (IT) and Instituto Superior Técnico, and Ivan Miguel Pires, from Instituto de Telecomunicações (IT) and University of Beira Interior.

The call for papers runs until 22 March 2022.

To submit your paper to EAI GOODTECHS 2022, follow the link:

Submissions should be in English, following the Springer formatting criteria. See the submission guidelines:

Visit the conference website: More Information..

CLONAR - Cloud Native Real Time Systems at ETFA 2022

on 06-09-2022

... The team Mohammad Ashjaei (Mälardalen University), Daniel Corujo (Instituto de Telecomunicações and Universidade de Aveiro) and Paulo Pedreiras (Instituto de Telecomunicações and Universidade de Aveiro) are organizing the Workshop CLONAR - Cloud Native Real Time Systems in conjunction with ETFA 2022.

The workshop will focus on the incorporation of cloud services that have been regarded for the realization and evolution of Industry 4.0 systems. One such cloud-based evolutionary example is the deployment of industrial processes and systems not as a virtualized translation of that system into cloud computing, but instead being built from scratch to be operated over the cloud. These are dubbed cloud-native applications, which embody the main principles of cloud operations, ranging from availability, distribution, scalability, resiliency, and other aspects of equal importance to the industrial domain. The challenge lies when the cloud and factory domains “collide” and complex engineering solutions need to provide the intended benefits, without incurring drawbacks. One of such examples lies with real-time communications, particularly in the scope of hard real-time communications, where the shared infrastructure environments and distributed locality of information pose stringent requirements and complexity for a cloud-native solution.

ETFA 2022 is the 27th Annual Conference of the IEEE Industrial Electronics Society (IES) focusing on the latest developments and new technologies in the field of industrial and factory automation. The conference aims to disseminate novel ideas and emerging trends, research results, and practical achievements. ETFA 2022 will be held on September 6-9, 2022, in Stuttgart, Germany.

CLONAR will be held on the first day of the conference, Sept 6. Papers are limited to 8 double-column pages they must comply with ETFA guidelines regarding formatting and must be submitted electronically in PDF format through the conference submission system. Accepted papers must be presented at the workshop to be included in the ETFA conference proceedings available at IEEEXplore.

If you would like to know more about the workshop please contact: Mohammad Ashjaei (; Daniel Corujo (; Paulo Pedreiras (

Photo credits: ETFA 2022

More Information..