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Call for Papers - International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design (SMACD’23)


on 03-07-2023

... The 2023 Edition of the International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design (SMACD’23) will be held from 3 to 5 July 2023, at VidaMar Resort Hotel, in Funchal, Madeira, Portugal.

SMACD is a forum devoted to modeling, simulation, and synthesis for Analog, Mixed-signal, RF (AMS/RF), and multi-domain (nanoelectronics, biological, MEMS, optoelectronics, etc.) integrated circuits and systems, as well as emerging technologies and applications. Open-source tools and methods for IC design and experiences with modeling, simulation, and synthesis techniques in diverse application areas are also welcomed. Objective technologies include CMOS, beyond CMOS, and More-than-Moore such as MEMs, power devices, sensors, passives, etc.

SMACD 2023 is accepting paper submissions until February 3rd, 2023, in the following areas of interest:

1 - CAD AND EDA METHODOLOGIES AND TOOLS FOR AMS SYSTEMS (CAD/EDA):
Synthesis, Sizing and Optimization; Modeling; Simulation, Verification and Test.
2 - EMERGING TECHNOLOGIES AND APPLICATIONS (ETA):
CAD for/using Emerging Technologies; Emerging Devices and Paradigms; Hardware Security.
3 - AMS ICS AND MULTI-DOMAIN DESIGN APPLICATIONS (DES):
Design Applications


SMACD is technically co-sponsored by IT, IST, IEEE, IEEE CEDA, IEEE CASS and others. The conference proceedings will be published in IEEExplore.

Important dates:
February 3rd, 2023: Paper Submission Deadline
March 17th, 2023: Author Notification
March 31st, 2023: Camera Ready Paper Submission
March 31st, 2023: Early Registration Deadline


For complete information, visit the official webpage of the conference:
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Call for Papers - 27th Edition of SPI: IEEE Workshop on Signal and Power Integrity


on 07-05-2023

... Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.

In view of previous years' success, the Committees are hardworking and keen on the 27th Edition which will be held as an in-person event in Aveiro, Portugal, on 7-10 of May of 2023. The technical program will include both oral and poster sessions, and several prominent experts will give keynotes on emerging interest areas. Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest:

• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design


Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®). Authors of the best-ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology. Please visit spi2023.av.it.pt/submissions for further information.

Students presenting a paper at the workshop may apply to the Student Awards. Please visit this next for further information: spi2023.av.it.pt/student-awards

(a) IEEE Electronics Packaging Society: Student Travel Grants
(b) IEEE SPI 2023: Best Student Paper


One of the goals for SPI 2023 is to provide an exceptional level of international exposure for Companies interested in sponsoring the event by promoting their products and services to all participants and significantly enhancing their visibility and reputation on Signal and Power Integrity expertise.

Registration for Sponsors is open! Please visit the next link for more on sponsorship conditions: spi2023.av.it.pt/sponsorships



The Workshop Chairs:

Joana Catarina Mendes: Instituto de Telecomunicações, Aveiro (POR)
Stefano Grivet-Talocia: Politecnico di Torino, Torino (ITA)



IMPORTANT DATES
• Full Paper Submission: January 31st, 2023
• Notification of Acceptance: March 15th, 2023
• Final Paper Submission: April 5th, 2023
• Early Bird Registration: April 5th, 2023
• Sponsors Registration: April 5th, 2023
• Student Awards Application: March 31st, 2023


Find more on the workshop webpage:

More Information..