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On-Chip ESD Protection Designs for RF ICs

on 20-09-2018

... Prof. Albert Wang, University of California

Date & time: Tuesday, October 2nd, 11:00h
Location: Instituto Superior Técnico, LT2 4th floor, Torre Norte

// Abstract:

Electrostatic discharge (ESD) failure is the most devastating IC reliability problem. As semiconductor technologies continue to advance to nano nodes, meanwhile ICs become more complex, on-chip ESD protection design emerges as a major IC design challenge, particularly for broad-band RF and high-speed ICs. This lecture discusses advanced on-chip ESD protection design techniques for RF ICs, including mixed-mode ESD simulation-design methods, accurate RF ESD characterization and ESD-IC co-design for RF ICs. Real-world ESD protection design examples, such UWB transceivers and 4G/5G RF switches, will be presented.

// Biography:

Albert Wang received the BSEE degree from Tsinghua University, China, and the PhD EE degree from State University of New York at Buffalo, USA, in 1985 and 1996, respectively. From 1995 to 1998, he was an IC design engineer at National Semiconductor Corporation, USA. From 1998 to 2007, He was a Professor of Electrical and Computer Engineering at the Illinois Institute of Technology, Chicago, USA. Since 2007, He has been a Professor of Electrical and Computer Engineering at the University of California, Riverside, USA, where he is Director for the Laboratory for Integrated Circuits and Systems and Director for the University of California system-wide Center for Ubiquitous Communications by Light. His research covers Analog/Mixed-Signal/RF ICs, Integrated Design-for-Reliability, 3D Heterogeneous Integration, IC CAD and Modelling, Biomedical Electronics, Emerging Nano Devices and Circuits, and LED-based Visible Light Communications. Wang received the CAREER Award from the National Science Foundation, USA. He published one book and more than 250 papers, and holds 15 US patents. Wang served on editorial boards for IEEE Electron Device Letters, IEEE Transactions on Circuits and Systems I, IEEE Transactions on Circuits and Systems II, IEEE Journal of Solid-State Circuits, and IEEE Transactions on Electron Devices. He has been an IEEE Distinguished Lecturer for IEEE Electron Devices Society, IEEE Solid-State Circuits Society and IEEE Circuits and Systems Society. He is Sr. Past President (2018-2019), and was Jr. Past President (2016-2017) and President (2014-2015) of IEEE Electron Devices Society. He was Chair of the IEEE CAS Analog Signal Processing Technical Committee (ASPTC) and committee member for the SIA International Technology Roadmap for Semiconductor (ITRS). He is a member of IEEE 5G Initiative Committee and IEEE Fellow Committee. He was General Chair (2016) and TPC Chair (2015) for IEEE RFIC Symposium. He served as committee member for many IEEE conferences, including IEDM, EDTM, BCTM, ASICON, IEDST, ICSICT, CICC, RFIC, APC-CAS, ASP-DAC, ISCAS, IPFA, ICEMAC, NewCAS, ISTC, IRPS, AP-RASC, MAPE, EDSSC, MIEL, etc. Wang is an IEEE Fellow and AAAS Fellow. More Information..

The 9th International Conference on Broadband Communications, Networks, and Systems

on 19-09-2018

... BROADNETs conference, hosted in the University of Algarve on 19th and 20th September 2018, aims to provide a platform where to disseminate and discuss key innovations and technology trends on the fast evolving arena of IoT and 5G. BROADNETS 2018 targets one of the key drivers for 5G and beyond 5G, the IoE world that includes technology advances in cyber-physical systems and security. The conference will also cover novel works applying 5G concepts to space and underwater communications. The event will count with the participation of prestigious keynote speakers in these areas such as Prof. R. Mesleh and Prof. C. B. Papadias, and the best technical contributions will be invited to submit extended paper versions to MONET (Mobile Networks and Applications, Springer).

More Information..