Creating and sharing knowledge for telecommunications

SPI 2024 – 28th IEEE Workshop on Signal and Power Integrity

on 12-05-2024


Standing for almost three decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a noteworthy forum of exchange on all aspects of Signal and Power Integrity, comprising the latest research and developments on design, characterization, modeling, simulation, and testing at chip, package, board, and system level. The workshop brings together developers and researchers from academia and industry in order to encourage cooperation.

In view of previous years' success, the Committees are hard working on the 28th Edition which will be held as an in-person event at the Portuguese Communications Foundation in Lisbon, Portugal. The technical program will include both oral and poster sessions, and several prominent experts will be giving keynotes and tutorials on areas of emerging interest.

Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest:

Modeling and simulation for SI/PI
Coupled signal and power integrity analysis
Noise reduction and equalization techniques
High-speed link design and modeling
Power distribution networks
RF/microwave/mm-wave systems and packaging solutions
Antennas-in-package and antennas-on-chip
3D IC and packages (TSV/SiP/SoC)
Nano-interconnects and nano-structures
Electromagnetic theory and modeling
Transmission line theory and modeling
Macromodeling, reduced order models
Electromagnetic compatibility
Design methodology/flow measurements
Jitter and noise modeling
Stochastic/sensitivity analysis
Electro-thermal modeling
Chip-package co-design
Novel CAD concepts
Optical interconnects
AI in electronics design

Accepted papers will be included in the workshop's program and submitted for inclusion into IEEE Xplore (subject to meeting scope and quality requirements for IEEE Xplore). Authors of the best-ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Paper Submission: December 15th, 2023
Notification of Acceptance: January 31st, 2024
Final Paper Submission: March 15th, 2024
Student Awards Application: March 15th, 2024
Early Bird Registration: March 15th, 2024
Sponsors Registration: March 22nd, 2024

Feel free to look into our website for further information about SPI 2024, as well as broadcast the workshop in your institution and to your fellow colleagues and students. It is a pleasure to invite you all to the 28th IEEE Workshop on Signal and Power Integrity and we look forward to your contribution and participation!

Workshop Chairs
Joana Catarina Mendes (Instituto de Telecomunicações - Aveiro, Portugal)
Nuno Horta (Instituto de Telecomunicações - Lisbon, Portugal)

Program Chairs
Antonio Maffucci (University of Cassino and Southern Lazio, Italy)
Stefano Grivet-Talocia (Politecnico di Torino, Italy)

Visit the workshop’s webpage for more information:

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