Wednesday, March 28th, 16:00h-17:30h
Instituto Superior Técnico, Lisbon, Room 4.12 (4th floor), Torre Norte
Laurent Dussopt, from the Commissariat à l’Energie Atomique et aux Energies Alternatives – Laboratoire d´ eletronique des technologie de l´ informationi (CEA-Leti), Grenoble, France, will do a presentation entitled “Overview of recent activities on mm-wave transmitarray antennas and terahertz imaging”:
ABSTRACT: The evolution of semiconductor and microtechnologies have triggered a very strong activity in the fields of millimeter-wave and now terahertz systems for wireless communications, radar and imaging. Cost-effective, efficient and reconfigurable antennas are often key-enabling technologies in such systems.
The first part of this presentation will cover the main developments of CEA-LETI on transmitarray antennas in frequency bands from 10 to 90 GHz with several prototypes of passive and reconfigurable arrays with beamsteering / beamforming / beamswitching capabilities. Characterization and integration solutions with active T/R modules will be discussed as well. The second part of the talk will present our activities on THz imaging with the development of terahertz detectors and cameras for emerging applications in industry (non-destructive control, spectro-imaging), biomedicine, instrumentation, and security.
Cyril Luxey, from IUT Réseaux et Télécoms in Sophia-Antipolis, Nice, France, will do a presentation entitled “Mm-wave antenna-system designs dedicated to high-data rate communications”:
ABSTRACT: Developing high data-rate wireless networks is of paramount importance to meet the growing demand of mobile services. To this end, millimeter-wave (mmW) System-on-Chip (SoC) approach in CMOS technology was extensively developed for the deployment of Gb/s wireless systems like WiGig at 60 GHz (up to 7 Gb/s). With the upcoming transition to 5G standard, large bandwidths (BWs) are now required to provide data rates higher than 10 Gb/s. MM-wave and Sub-THz frequency bands are strongly considered since BWs of several 10s of GHz are easily accessible.
Experimental 100 Gb/s wireless links using III-V photonic technology have been demonstrated above 200 GHz. Indeed, photonic transmitters feature naturally higher BWs (>50 GHz) than solid-state transmitters. However, either if a solid-state or a photonic based-link is employed to reach the aforementioned high-data rates, broadband efficient integrated Antenna-in-Package (AiP) are needed either as stand-alone antennas for short communication links or as antenna-sources of a larger quasi-optical radiator for long-distance communication links (>100m). Significant advantages of this approach are high-volume manufacturing capability and high electronics integration level, both of which result in lower associated costs. This presentation will discuss antenna-system performance already obtained using organic packaging technologies and 3D-printed quasi-optical antenna-solutions from 60 to 240GHz with point-to-point transmission link demonstration.