@INPROCEEDINGS {36393,
author={P.  Bou├ža},
doi={},
booktitle={IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies IMWS-5G},
title={Mutual Coupling Reduction Using Grounded Copper Vertical Plane Structure},
year={2018},
month={August},
volume={},
pages={-} 
}
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